A particularly surprising discovery is that CXMT is constructing its cleanrooms—where the actual silicon is produced—in just around 12 months, whereas the rest of the DRAM manufacturing industry typically takes 21-24 months, nearly a full year longer.
Finally, the report notes that the Chinese government is encouraging CXMT to transfer its DRAM technology IP to other Chinese DRAM manufacturers such as JHICC, Swaysure, and YTMC’s subsidiary XMC. This initiative aims to alleviate memory shortages domestically before CAMT-designed DRAM enters other markets, such as the EU and possibly even the U.S.
Having actually done this, the clean room part is super easy. Getting all the equipment in and running is extremely hard. Finding out all the things you messed up along the way and getting actual yields is extremely hard and also time consuming. So I’d like to know where along that process they are doing the timeline comparison.